Vapor source having linear aperture and coating process

Details Vapor source having linear aperture and coating process Vapor source having linear aperture and coating process

C - Chemistry, Metallurgy

23

C

C23C 14/26 (2006.01) C23C 14/56 (2006.01)

Patent

CA 2350319

A linear aperture deposition apparatus and process are provided for coating substrates with sublimed or evaporated coating materials. The apparatus and process are particularly suited for producing flexible films having an optical interference coating with a very high surface thickness uniformity and which is substantially free of defects from particulate ejection of a source material. The apparatus includes a source box containing a source material, a heating element to sublime or evaporate the source material, and a chimney to direct the source material vapor from the source box to a substrate. A flow restricting baffle having a pluralityof holes is positioned between the source material and the substrate to confine and direct the vapor flow, and an optional floating baffle is positioned on the surface of the source material to further restrict the vapor flow, thereby substantially eliminating source material spatter.

La présente invention concerne un appareil et un procédé à ouvertures linéaires de dépôt destiné au revêtement de substrats à l'aide de matières de revêtement en phase vapeur ou sous forme sublimée . L'appareil et le procédé sont particulièrement adaptés pour produire des couches minces flexibles dont le revêtement à interférence optique présente une très haute uniformité d'épaisseur de surface et qui est sensiblement exempt de défauts dus à l'éjection particulaire d'une matière source. L'appareil comprend un caisson source contenant une matière source, un élément chauffant permettant de sublimer ou d'évaporer ladite matière source, et une cheminée pour diriger vapeur de la matière source de la boîte source sur un substrat. Un écran limitateur de flux percé d'une pluralité de trous est positionné entre la matière source et le substrat afin de confiner et diriger le flux de vapeur, et un écran flottant optionnel est positionné à la surface de la matière source pour limiter davantage le jet de vapeur, éliminant ainsi sensiblement les projections intempestives de la matière source.

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