Wafer holder for semiconductor manufacturing apparatus,...

Details Wafer holder for semiconductor manufacturing apparatus,... Wafer holder for semiconductor manufacturing apparatus,...

H - Electricity

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H01L 21/68 (2006.01) C04B 37/00 (2006.01) C04B 41/52 (2006.01) C04B 41/89 (2006.01) H01L 21/48 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2329816

A wafer holder for a semiconductor manufacturing apparatus that has a high heat conductivity and includes a conductive layer such as heater circuit pattern which can be formed with a high precision pattern, a method of manufacturing the wafer holder, and a semiconductor manufacturing apparatus having therein the wafer holder are provided. On a surface of a sintered aluminum nitride piece, paste containing metal particles is applied and fired to form a heater circuit pattern as a conductive layer. Between the surface of the sintered aluminum nitride piece having the heater circuit pattern formed thereon and another sintered aluminum nitride piece, a glass layer is provided as a joint layer to be heated for joining the sintered aluminum nitride pieces together.

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