Wafer transferring chuck assembly

Details Wafer transferring chuck assembly Wafer transferring chuck assembly

B - Operations, Transporting

23

B

29/19

B23B 31/00 (2006.01) G03F 7/20 (2006.01) H01L 21/68 (2006.01) H01L 21/683 (2006.01)

Patent

CA 1233628

ABSTRACT A wafer chuck assembly having a platen disposed within a housing, and having a wafer lifter mechanism which may be raised for accepting a wafer and lowered to place it precisely on the platen without changing its spatial orientation. The wafer lifter mechanism comprises a base having a cylinder formed therein. A shaft is disposed in the cylinder. An expanded portion of the shaft and the base are connected to opposite ends of a metal bellows which together form an airtight volume islet which pressurized air may be in- troduced or exhausted to raise or lower the shaft. Fixed to one end of the shaft is a rubber cup to which vacuum may be applied to secure a wafer thereto. The metal bellows and its interconnection within the wafer lifter mechanism function to prevent rotational movement of the shaft and, therefore, of the wafer when it is lowered to deposit the wafer onto the platen.

454033

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