Water thinnable epolxy resin and process for preparing same

Details Water thinnable epolxy resin and process for preparing same Water thinnable epolxy resin and process for preparing same

C - Chemistry, Metallurgy

08

G

C08G 59/14 (2006.01) C09D 163/00 (2006.01) C09D 177/08 (2006.01)

Patent

CA 2061669

ABSTRACT A water thinnable epoxy resin prepared by (1) reacting: (a) an epoxy resin having an average of greater than one vicinal epoxy group; (b) a phenolic compound having greater than one hydroxyl group; and (c) a polyamide dicarboxylic acid having an amine value of not greater than 20 and an acid value of from 20 to 200, prepared by reacting a dimer acid based polymerized fatty acid with diamine at a polymerized fatty acid/diamine molar ratio of from 2:1.0 to 2:1.9, at a ratio of such that the amount of the polyamide dicarboxylic acid segment in the resin ranges from 0.1 to 50 percent by weight based on the weight of the resin, to obtain a polyamide 39,593-F modified epoxy resin having an acid value of not greater than 5; (2) reacting the obtained polyamide modified epoxy resin with (d) a phosphoric acid source material to obtain an epoxy phosphate ester resin; and then (3) hydrolyzing the obtained epoxy phosphate ester resin, is disclosed. A process for preparing the water thinnable epoxy resin is also disclosed. 39,593-F

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