Metallization for printing conductor patterns upon a ceramic...

Details Metallization for printing conductor patterns upon a ceramic... Metallization for printing conductor patterns upon a ceramic...

C - Chemistry, Metallurgy

03

C

309/5, 75/1.21

C03C 17/10 (2006.01) G11B 5/09 (2006.01) H01B 1/06 (2006.01) H01B 1/16 (2006.01) H05B 3/12 (2006.01) H05B 3/84 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1215863

ABSTRACT OF THE DISCLOSURE A metallization for printing conductor patterns upon a ceramic substrate is disclosed. The metallization is comprised of an admixture of finely divided particles of (1) 60 to 98.5% wt. conductive metal, (2) 20 to 1% wt. inorganic binder, and (3) 20 to 0.5% wt. of a colorant which is a mixture of 5 to 60% wt. of an oxide or oxide precursor of copper, silver or mixtures thereof and 95 to 40% wt. of B2O3 or precursor thereof. The colorant is comprised of no more than 40% wt. of the oxide of silver or 60% wt. of the oxide of copper. The metallization is useful, for example, for making automobile window defoggers.

425875

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