Field-assisted sealing

Details Field-assisted sealing Field-assisted sealing

C - Chemistry, Metallurgy

03

C

C03C 27/00 (2006.01) B01J 19/00 (2006.01) B32B 17/06 (2006.01) B81B 1/00 (2006.01) B81C 1/00 (2006.01) C03C 27/06 (2006.01) C03C 27/08 (2006.01) C04B 37/04 (2006.01)

Patent

CA 2236788

The invention provides a method of bonding a glass substrate (740) and a nonconductive substrate (750) comprising the steps of: (a) contacting a surface of the nonconductive substrate (750), which is coated with a field- assist bonding material (760), with a conforming surface of the glass substrate (740); and (b) applying sufficient heat to the two substrates and sufficient voltage across the two substrates to bond the two substrates together.

La présente invention concerne un procédé de liaison entre un substrat en verre (740) et un substrat non conducteur (750), ce procédé comprenant les opérations suivantes: (a) Mettre en contact une surface du substrat non conducteur (750), qui est couvert d'une matière de liaison (760) assistée par un champ électrique, et une surface correspondante du substrat en verre (740); (b) appliquer une chaleur suffisante aux deux substrats et une tension suffisante à travers eux pour les lier l'un à l'autre.

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