Process for fabricating an integrated circuit

Details Process for fabricating an integrated circuit Process for fabricating an integrated circuit

H - Electricity

01

L

H01L 21/78 (2006.01) H01L 21/304 (2006.01) H01L 21/68 (2006.01)

Patent

CA 2143077

A process for fabricating devices is disclosed. Numerous devices are formed on a substrate. The substrate is then placed on an adhesive tape mounted on a dicing ring. The devices are then separated into individual chips by dicing the substrate. Prior to dicing, the substrate is coated with a material that is relatively insoluble in water. After the substrate is diced, the coating is removed by rinsing the substrate with an organic solvent in which the material is substantially soluble. The organic solvent dissolves the coating but does not dissolve the adhesive on the tape or otherwise adversely effect the adhesion between the tape and the substrate.

Affiliated with

Also associated with

Rating

Process for fabricating an integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for fabricating an integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for fabricating an integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1428150