B - Operations – Transporting – 81 – B
Patent
B - Operations, Transporting
81
B
B81B 7/02 (2006.01) B81C 1/00 (2006.01) H05K 3/00 (2006.01) H05K 3/40 (2006.01) B81B 3/00 (2006.01)
Patent
CA 2464582
A method of fabricating electromechanical devices such as micro relays on printed circuit boards. The method includes the deposition of an element of the component onto an electrically conducting sacrificial layer, which is subsequently removed to form a PCB component that is suspended above the PCB substrate. In one embodiment, the vias in a multilayer PCB are used as the anchor posts for the suspended component. See stages 6.1 - 6.8 of figure 6.
Cette invention porte sur un procédé de fabrication de dispositifs électromécaniques tels que des micro-relais sur des cartes de circuits imprimés. Ce procédé consiste à déposer un élément du composant sur une couche sacrificielle conductrice qui est ensuite retirée pour former un composant de carte de circuits imprimés qui est suspendu au-dessus du substrat de carte de circuits imprimés. Dans un mode de réalisation de cette invention, les trous de raccordement dans une carte de circuits imprimés multicouches sont utilisés comme points d'ancrage pour le composant suspendu.
Orr Bruce
Sexton Brett
Micro Relay Holdings Pty Ltd
Osler Hoskin & Harcourt Llp
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