B - Operations – Transporting – 81 – B
Patent
B - Operations, Transporting
81
B
B81B 7/00 (2006.01) E21B 47/01 (2006.01) E21B 47/06 (2006.01) E21B 49/08 (2006.01)
Patent
CA 2623013
The present invention provides packaging for MEMS devices and other sensors for downhole application. The MEMS devices and/or other sensors may aid in characterizing formation fluids in situ. The packaging facilitates high temperature, high pressure use, which is often encountered in downhole environments.
L'invention concerne un boîtier pour dispositifs MEMS et autres capteurs destinés à une application en fond de puits. Les dispositifs MEMS et/ou autres capteurs permettent de faciliter la caractérisation de fluides de formation in situ. Le boîtier facilite leur utilisation à des températures et des pression élevées souvent rencontrées dans des environnements de fond de trou.
Chikenji Akihito
Nouaze Veronique
Sugimoto Tsutomu
Terabayashi Toru
Yamate Tsutomu
Kyocera Corporation
Schlumberger Canada Limited
Smart & Biggar
LandOfFree
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