C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
204/167.4
C23C 14/34 (2006.01) H01J 37/34 (2006.01)
Patent
CA 1308060
ABSTRACT OF THE DISCLOSURE An improved cathode and sputtering target design for sputter coaling, permitting operation with larger cathodes and at higher power levels than heretofore possible. The cathode and target assembly includes a cathode body, a target holder, and a sputtering target. The cathode body function as a magnetic pole piece, a portion of the cooling system, and a mechanical stabilizer for the target. The target holder also provides cooling, by means of cooling passages and by intermeshing cooling means in contact with the target. The sputtering target has an arch-like face that promotes a controlled plastic deformation in a preselected direction, so that heat-induced expansion during operation results in the target being urged into forceful, intimate contact with at least two cooled surfaces.
533793
Gowling Lafleur Henderson Llp
Materials Research Corporation
Tokyo Electron Limited
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