Ceramic microelectromechanical structure

B - Operations – Transporting – 81 – B

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B81B 3/00 (2006.01) H01H 1/00 (2006.01) H01H 59/00 (2006.01) H01P 1/12 (2006.01) H05K 1/09 (2006.01) H05K 3/02 (2006.01)

Patent

CA 2417352

A microelectromechanical structure having a ceramic substrate formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can be a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. A switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

L'invention porte sur une structure microélectromécanique possédant un substrat céramique formé dans des feuilles céramiques cuites simultanément à basse température. Une couche de planarisation de diélectrique photodéfinissable, à faible perte, est formée sur une surface du substrat céramique. Cette couche peut être une couche sacrificielle ou une couche sacrificielle ajoutée ultérieurement. Un conducteur photodéfini est imprimé sur la couche de planarisation de diélectrique à faible perte et formé avec la couche sacrificielle dans un composant de circuit structural. Un commutateur est formé d'un actionneur de sollicitation et d'un élément apte à fléchir formé sur l'actionneur de sollicitation et pouvant se déplacer pour se mettre en position ouverte et fermée.

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