Circuit board packaging structure

Details Circuit board packaging structure Circuit board packaging structure

H - Electricity

05

K

H05K 7/18 (2006.01) H05K 7/14 (2006.01) H05K 7/16 (2006.01)

Patent

CA 2244825

A circuit board packaging structure, comprises a number of first rectangular circuit boards each packaged with electric circuit parts and disposed in parallel with each other; and a second circuit board packaged with electric circuit parts and disposed in a direction orthogonal to respective sides of the first circuit boards. The first circuit boards are electrically connected to said second circuit board. A cooling fan flows cooling air along the second circuit board. The electric circuit parts constitute a transmission line corresponding unit, of a switching equipment, for accommodating a number of transmission lines and, at the same time, processing the data from each transmission line on a packet-basis.

Cette invention concerne un montage de plaquettes à circuits intégrés sous boîtier comprenant un nombre donné de premières plaquettes rectangulaires disposées en parallèle et une seconde plaquette à circuits intégrés disposée perpendiculairement aux premières plaquettes à circuits intégrés. Les premières plaquettes à circuits intégrés sont raccordées électriquement à ladite seconde plaquette à circuits intégrés. Un ventilateur de refroidissement souffle de l'air sur la seconde plaquette à circuits intégrés. Les circuits intégrés forment l'interface d'un appareil de commutation de plusieurs lignes de transmission et assurent en même temps le traitement par paquets des données de chaque ligne de transmission.

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