Compression and cold weld sealing methods and devices

Details Compression and cold weld sealing methods and devices Compression and cold weld sealing methods and devices

B - Operations, Transporting

81

B

B81B 7/00 (2006.01)

Patent

CA 2584851

Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

La présente invention se rapporte à des procédés de soudage à froid par compression, à des structures de joints et à des dispositifs de confinement hermétiquement fermés. Le procédé selon l'invention consiste : à fournir un premier substrat possédant au moins une première structure de joint dotée d'une première surface d'assemblage, laquelle est constituée d'un premier métal ; à fournir un second substrat possédant au moins une seconde structure de joint dotée d'une seconde surface d'assemblage, laquelle est constituée d'un second métal ; et à comprimer ensemble les première et seconde structures de joint, afin de provoquer la déformation et le cisaillement locaux des surfaces d'assemblage au niveau d'une ou plusieurs interfaces, la déformation et le cisaillement atteignant un degré suffisant pour former une liaison métal-métal entre le premier métal et le second métal des surfaces d'assemblage.Les chevauchements au niveau des surfaces d'assemblage permettent de déplacer les contaminants de surface et de faciliter le contact intime entre les surfaces d'assemblage, et ce sans apport de chaleur. Des dispositifs hermétiquement fermés peuvent contenir des préparations de médicaments, des biocapteurs ou des dispositifs MEMS.

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