Easy adhesion polyamide film and production method therefor

Details Easy adhesion polyamide film and production method therefor Easy adhesion polyamide film and production method therefor

B - Operations, Transporting

32

B

B32B 27/34 (2006.01) B29C 55/12 (2006.01) B32B 27/40 (2006.01)

Patent

CA 2751547

Disclosed is an easy adhesion polyamide film including a substrate polyamide film and a primer layer containing an anionic water-dispersible polyurethane resin, formed on at least one side of the substrate polyamide film. The thickness of the primer layer is 0.025 µm or more and 0.250 µm or less. The anionic water-dispersible polyurethane resin has a coating film elongation percentage of 250% or more and a tensile strength of 20 MPa or more. When the easy adhesion polyamide film is subjected to a heat treatment in a helium gas atmosphere at 200°C for 10 minutes, a total amount of the volatile base components evolved from the easy adhesion polyamide film is 0.50 µg/g or less.

L'invention porte sur un film de polyamide hautement adhérent qui comporte un film de polyamide de base, et une couche d'amorce formée sur au moins une surface du film de polyamide de base, ladite couche d'amorce contenant une résine polyuréthane dispersable dans l'eau anionique. La couche d'amorce a une épaisseur entre 0,025 et 0,250 µm inclus. La résine de polyuréthane dispersable dans l'eau anionique a une élasticité de film d'au moins 250 %, et une résistance à la traction d'au moins 20 MPa. Le film de polyamide hautement adhérent génère un total de composants alcalins volatiles non supérieurs à 0,50 µg/g lorsqu'il est traité à la chaleur pendant 10 minutes à 200°C sous une atmosphère d'hélium.

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