Encapsulation process for microelectromechanical structures

Details Encapsulation process for microelectromechanical structures Encapsulation process for microelectromechanical structures

B - Operations, Transporting

81

C

B81C 1/00 (2006.01) B81C 99/00 (2010.01) B81B 7/00 (2006.01) B81B 3/00 (2006.01)

Patent

CA 2325097

A method of encapsulating microelectromechanical (MEMS) structures is provided wherein the MEMS structures are formed on a substrate and encapsulated prior to packaging thereof. A sacrificial material is first deposited over the substrate to cover at least a portion of the MEMS structure. An encapsulation material is then deposited over the sacrificial material such that the encapsulation material covers at least a portion of the sacrificial material over the MEMS structure. The sacrificial material is subsequently removed such that the encapsulation material forms a shell spaced apart from and covering the MEMS structure and permits the intended operation of the MEMS structure. Associated MEMS devices fabricated using a method of encapsulating MEMS structures according to embodiments of the present invention are also provided.

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