Hermatic firewall for mems packaging in flip-chip bonded...

Details Hermatic firewall for mems packaging in flip-chip bonded... Hermatic firewall for mems packaging in flip-chip bonded...

B - Operations, Transporting

81

C

B81C 99/00 (2010.01) B81B 7/00 (2006.01) B81B 7/02 (2006.01) H01L 23/04 (2006.01) H01L 23/057 (2006.01) H01L 23/10 (2006.01)

Patent

CA 2322978

A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate spaced from the first substrate hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal material placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packaging techniques which is often detrimental to MEMS device function.

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