Housing for micromechanical and micro-optic components used...

B - Operations – Transporting – 81 – B

Patent

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B81B 7/00 (2006.01)

Patent

CA 2675501

The invention relates to a housing for one or more micro-mechanical and/or micro-optical components. Said housing comprises a carrier substrate having at least one micro-mechanical and/or micro-optical component and at least one cover substrate that is connected to the carrier substrate. The carrier substrate and the at least one cover substrate form at least one cavity that at least partially surrounds the at least one micro-mechanical and/or micro-optical component. The side of the at least one cover substrate facing the at least on micro-mechanical and/or micro-optical component comprises at least one optical window and at least one mechanical stop. The invention also relates to a method for producing said type of housing and said method can also be used, in particular, for encapsulating wafer planes.

La présente invention concerne un boîtier destiné à un ou plusieurs composants micro-mécaniques et/ou micro-optiques, le boîtier présentant un substrat de support comprenant au moins un composant micro-mécanique et/ou micro-optique, et au moins un substrat de recouvrement qui est relié au substrat de support. Selon l'invention, le substrat de support et le(s) substrat(s) de recouvrement forment au moins une cavité qui renferme au moins partiellement le(s) composant(s) micro-mécanique(s) et/ou micro-optique(s), le côté d'au moins un substrat de recouvrement, orienté vers le(s) composant(s) micro-mécanique(s) et/ou micro-optique(s) présentant au moins une fenêtre optique et au moins une butée mécanique. L'invention a également pour objet un procédé de réalisation d'un tel boîtier, le procédé pouvant notamment s'appliquer à l'encapsulation sur le plan tranche de semi-conducteur.

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