Integrated mems packaging

Details Integrated mems packaging Integrated mems packaging

B - Operations, Transporting

81

B

B81B 7/02 (2006.01) B81C 99/00 (2010.01)

Patent

CA 2663392

The microelectromechanical system (MEMS) package includes a substrate onto which is disposed or otherwise formed an active MEMS device, a cap for hermetically sealing the MEMS package and a pair of barrier walls for preventing bonding material for the cap from contaminating unintended areas of the substrate.

Le boîtier de microsystème électromécanique (MEMS) selon l'invention comprend un substrat sur lequel est disposé ou formé de quelque autre manière que ce soit un composant MEMS actif, un capot permettant de sceller hermétiquement le boîtier MEMS et deux cloisons formant barrière qui empêche que le liant du capot ne contamine les zones non souhaitées du substrat.

Affiliated with

Also associated with

Rating

Integrated mems packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated mems packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated mems packaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1458409