C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
13/14, 148/24
C23C 8/12 (2006.01) B23K 20/16 (2006.01) B23K 35/38 (2006.01) B32B 15/01 (2006.01)
Patent
CA 2004074
-9- METAL-TO-METAL BONDING METHOD AND RESULTING STRUCTURE Abstract Of The Invention A method and resulting structure is disclosed in which a metal-to-metal bond is formed by heating the surfaces to be bonded in an oxidizing ambient atmosphere until the desired bond is achieved. Heating takes place at 600°C. - 1150°C. and bonding may be enhanced by applying pressure between the surfaces while heating.
Nayak Deepak
Reisman Arnold
Turlik Iwona
Microelectronics Center Of North Carolina
Nayak Deepak
Northern Telecom Limited
Reisman Arnold
Sim & Mcburney
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