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Iwona Turlik

H - Electricity – 01 – L

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Country: Canada

Gas seal for semiconductor processing equipment

H - Electricity – 01 – L
Patent

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High density semiconductor structure and method of making...

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High performance integrated circuit chip package and method...

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Metal-to-metal bonding method and resulting structure

C - Chemistry – Metallurgy – 23 – C
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High density semiconductor structure and method of making...

H - Electricity – 01 – L
Patent

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Metal-to-metal bonding method and resulting structure

C - Chemistry – Metallurgy – 23 – C
Patent

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Profile ID: LFCA-PAI-P-1148010

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