B - Operations – Transporting – 81 – B
Patent
B - Operations, Transporting
81
B
B81B 7/00 (2006.01)
Patent
CA 2543736
The invention concerns a method and a device for assembling treated semiconductor wafers (1, 2), for obtaining not only a secure assembly, but an electrical connection (5) between the semiconductor wafers or between the electronic structures (3) comprising the latter as well. The invention is characterized in that the secure assembly is produced by means of structured intermediate glass layers (6; 6a), with low melting point, acting as insulating layers, and the electrical connection is produced by means of an electroconductive sealing glass (5).
L'invention concerne un procédé et un dispositif pour assembler des plaquettes de semiconducteurs traitées (1,2), permettant de réaliser non seulement un assemblage solide, mais aussi une connexion électrique (5) entre les plaquettes de semiconducteur ou entre les structures électroniques (3) comportant ces dernières. Selon l'invention, l'assemblage solide est réalisé au moyen de couches intermédiaires en verre (6; 6a), structurées, à bas point de fusion, servant de couches isolantes, et la connexion électrique est réalisée au moyen d'un verre de scellement électroconducteur (5).
Gowling Lafleur Henderson Llp
X-Fab Semiconductor Foundries Ag
LandOfFree
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