Method and system for packaging mems devices with...

B - Operations – Transporting – 81 – B

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B81B 7/02 (2006.01) B81C 1/00 (2006.01) G02B 26/00 (2006.01) G02F 1/01 (2006.01) G02F 1/13 (2006.01) G02F 1/21 (2006.01)

Patent

CA 2519656

Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure 70 includes a seal 78 with a chemically reactive getter. Another embodiment of a MEMS device package 800 comprises a primary seal 805 with a getter, and a secondary seal 804 proximate an outer periphery of the primary seal 805. Yet another embodiment of a MEMS device package 900 comprises a getter 902 positioned inside the MEMS device package 900 and proximate an inner periphery 903 of the package seal 78.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Method and system for packaging mems devices with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and system for packaging mems devices with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and system for packaging mems devices with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1563146

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.