Method and system for providing mems device package with...

Details Method and system for providing mems device package with... Method and system for providing mems device package with...

B - Operations, Transporting

81

B

B81B 7/02 (2006.01) B81B 7/04 (2006.01) B81C 1/00 (2006.01) G02B 26/00 (2006.01) G02F 1/01 (2006.01) G02F 1/13 (2006.01) G02F 1/21 (2006.01)

Patent

CA 2519484

A MEMS device package 70 comprises a substrate 72 with a MEMS device 76 formed thereon, a backplane 74, and a primary seal 78, wherein the primary seal is positioned between the backplane and the substrate to encapsulate and seal the MEMS device package from ambient conditions. The MEMS device package further comprises a secondary seal 82 in contact with at least the backplane and the substrate.

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