B - Operations – Transporting – 81 – B
Patent
B - Operations, Transporting
81
B
B81B 1/00 (2006.01) A61M 37/00 (2006.01) B81C 1/00 (2006.01)
Patent
CA 2517988
A method is provided for manufacturing microstructures of the type which contain a substrate and an array of protruding microelements with through- holes, which are used in penetrating layers of skin. The microelements are embossed or pressed into an initial substrate structure, which in some embodiments is formed from extruded polymeric material, and in some cases from two layers of polymer that are co-extruded. The through-holes are formed from filled through-cylinders of a second material that is removed after the embossing or pressing step; in other instances, the through-holes are left hollow during the embossing or pressing step.
L'invention concerne un procédé de fabrication de microstructures du type à substrat et alignement de micro-éléments protubérants qui présentent des trous, que l'on utilise pour pénétrer dans des couches de la peau. Les micro-éléments sont réalisés par emboutissage ou estampage dans une structure de substrat initial, qui selon certaines variantes est en matériau polymère extrudé, et qui dans certains cas est établie à partir de deux couches de polymère co-extrudées. Les trous sont réalisés au moyen de cylindres pleins constitués d'un second matériau éliminé après l'emboutissage ou l'estampage. On peut aussi laisser les trous en creux durant l'emboutissage ou l'estampage.
Gartstein Vladimir
Sherman Faiz Feisal
Battison Williams Dupuis
Corium International Inc.
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