Method for metallising non-conductive substrates

Details Method for metallising non-conductive substrates Method for metallising non-conductive substrates

C - Chemistry, Metallurgy

25

D

C25D 5/56 (2006.01) C23C 18/28 (2006.01) H01M 4/80 (2006.01) H05K 3/10 (2006.01)

Patent

CA 2167074

A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable reagent, and (d) electrolytically depositing at least one metal film (11) on said film (9).

Le procédé comprend les étapes suivantes: a) on prépare une dispersion (4) d'un oxyde de cuivre à l'état divisé comprenant un solvant et un liant sélectionné, b) on applique ladite dispersion sur ledit substrat non-conducteur (1), pour former une couche (5), c) on forme une couche avec Cu (9), par action d'un réactif adapté, d) on dépose sur ladite couche (9) su moins une couche métallique (11) par dépôt électrolytique.

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