Method for producing thin, free-standing layers of solid...

Details Method for producing thin, free-standing layers of solid... Method for producing thin, free-standing layers of solid...

B - Operations, Transporting

81

C

B81C 1/00 (2006.01) B28D 1/22 (2006.01)

Patent

CA 2747840

It is disclosed a method of printing comprising the steps of: providing a solid state material having at least one exposed surface; applying an auxiliary layer to the exposed surface to form a composite structure, the auxiliary layer having a stress pattern; subjecting the composite structure to conditions facilitating fracture of the solid state material along a plane at a depth therein; and removing the auxiliary layer and, therewith, a layer of the solid state material terminating at the fracture depth, an exposed surface of the removed layer of solid state material having a surface topology corresponding to the stress pattern.

L'invention concerne un procédé d'impression comprenant les étapes consistant à : fournir un matériau semi-conducteur ayant au moins une surface exposée; appliquer une couche auxiliaire à la surface exposée pour former une structure composite, la couche auxiliaire présentant un motif de contrainte; soumettre la structure composite à des conditions facilitant la fracture du matériau semi-conducteur le long d'un plan à une profondeur dans celui-ci; et retirer la couche auxiliaire et, avec celle-ci, une couche du matériau semi-conducteur se terminant à la profondeur de la fracture, une surface exposée de la couche retirée de matériau semi-conducteur présentant une topologie de surface correspondant au motif de contrainte.

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