Method for the production of a component, and component

B - Operations – Transporting – 81 – B

Patent

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B81B 7/00 (2006.01)

Patent

CA 2687775

The invention relates to a method for producing a component (2), especially a micromechanical, micro-electro-mechanical, or micro-opto-electro-mechanical component (2), as well as such a component (2) which has an active structure (27) that is embedded in a layer structure. In order to be able to better contact electrodes (5) of the active structure (27), strip conductor bridges (34) are formed by etching first and second depressions (14, 15) having a first and second, different etching depth (D1, D2) into a covering layer (13) of a first layer combination (10) that additionally encompasses a substrate (11) and an insulation layer (12). The deeper depression (14) is used for insulating the strip conductor bridge (34) while the shallower depression (15) provides a moving space for the active structure (27), said moving space being bridged by the strip conductor bridge (34).

L'invention concerne un procédé de production d'un composant (2), en particulier, d'un composant micromécanique, micro-électromécanique ou micro-opto-électromécanique (2), ainsi que le composant précité obtenu, lequel présente une structure active (27) qui est encastrée dans une structure stratifiée. En vue d'obtenir un meilleur mode de contact des électrodes (5) de la structure active (27), l'invention est caractérisée en ce qu'on forme des ponts de bandes conductrices (34), par attaque produisant des premiers et des seconds creux (14, 15) de profondeurs d'enlevage différentes (D1, D2) dans une couche de recouvrement (13) d'un premier composite stratifié (10) qui présente en outre un substrat (11) et une couche d'isolation (12). Le creux le plus profond (14) sert à l'isolation du pont de bande conductrice (34), cependant que le creux faiblement profond (15) fournit un espace de déplacement pour la structure active (27), espace qui est ponté par le pont de bande conductrice (34).

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