Methods for fabricating micro-electro-mechanical devices

Details Methods for fabricating micro-electro-mechanical devices Methods for fabricating micro-electro-mechanical devices

B - Operations, Transporting

81

C

B81C 1/00 (2006.01) A61K 9/72 (2006.01) B81B 1/00 (2006.01)

Patent

CA 2607887

A method for fabricating a micro-electro-mechanical device (such as a cMUT) is disclosed. The method combines a substrate, a middle spring layer and a top plate using wafer bonding technology or sacrificial technology. A cavity is formed on either the top of the substrate or the bottom of the middle spring layer. A connector is formed on either the top of the middle spring layer or the bottom of the top plate. Upon joining the three layers, the connector defines a transducing space between the top plate and the middle spring layer. The connector is horizontally distanced from the sidewall to define a cantilever anchored at the sidewall. The cantilever and the cavity allow a vertical displacement of the connector, which transports the top wafer in a piston-like motion to change the transducing space. Multiple device elements can be made on the same substrate.

A method for fabricating a micro-electro-mechanical device (such as a cMUT) is disclosed. The method combines a substrate, a middle spring layer and a top plate using wafer bonding technology or sacrificial technology. A cavity is formed on either the top of the substrate or the bottom of the middle spring layer. A connector is formed on either the top of the middle spring layer or the bottom of the top plate. Upon joining the three layers, the connector defines a transducing space between the top plate and the middle spring layer. The connector is horizontally distanced from the sidewall to define a cantilever anchored at the sidewall. The cantilever and the cavity allow a vertical displacement of the connector, which transports the top wafer in a piston-like motion to change the transducing space. Multiple device elements can be made on the same substrate.

Affiliated with

Also associated with

Rating

Methods for fabricating micro-electro-mechanical devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods for fabricating micro-electro-mechanical devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods for fabricating micro-electro-mechanical devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1980049