Micro-electromechanical devices and methods of manufacture

B - Operations – Transporting – 81 – B

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B81B 3/00 (2006.01)

Patent

CA 2377189

Micro-electromechanical devices, substrate assemblies from which the devices can be manufactured, and methods to manufacture the devices are disclosed. The invention combines the advantages of conventional surface and bulk micromachining processes using a sacrificial layer to create an integrated micro-electromechanical system (MEMS) technology that provides high performance, high yield, and manufacturing tolerance. The devices manufactured according to the present invention include, but are not limited to, pressure sensors, vibration sensors, accelerometers, gas or liquid pumps, flow sensor, resonant devices, and infrared detectors.

La présente invention concerne des dispositifs microélectriques, des ensembles substrats à partir desquels on peut fabriquer ces dispositifs, et des procédés de fabrication de ces dispositifs. Cette invention associe les avantages de processus classiques de micro-usinage de volume et de surface utilisant une couche sacrificielle pour créer une technique de système mécanique microélectrique intégré (MEMS) caractérisé par des performances supérieures, un haut rendement, et une tolérance de fabrication. Les dispositifs fabriqués selon cette invention sont, entre autres, des capteurs de pression, des capteurs de vibration, des accéléromètres, des pompes à gaz ou à liquides, des dispositifs résonnants, et des détecteurs infrarouges.

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