B - Operations – Transporting – 81 – B
Patent
B - Operations, Transporting
81
B
B81B 1/00 (2006.01) B29C 67/00 (2006.01) B32B 3/00 (2006.01) B32B 3/20 (2006.01) B81C 1/00 (2006.01) B81C 3/00 (2006.01)
Patent
CA 2412061
The present invention provides a method of manufacturing a microdevice having a fine capillary cavity formed as a cut portion of a very thin layer which is likely to be broken, particularly a method of manufacturing a microdevice having complicated passages formed in three dimensions with high productivity. Also, the present invention provides a multi- functional microdevice which has a fine capillary passage formed by laminating plural resin layers, fine capillary cavities piercing through the respective layers to communicate and intersect three-dimensionally with each other, a space which should serve as a reaction chamber, a diaphragm valve, and a stopper structure. The method includes the steps of forming a semi-cured coating film having a cut portion made of an active energy ray curable composition on a coating substrate, laminating the semi-cured coating film with another member and removing the substrate, irradiating the semi-cured coating film again with an active energy ray before and/or after the removal of the substrate, thereby curing the coating film and bonding with said another member. The microdevice has a multi-layered structure wherein a member (J') (selected from a member having a cut portion piercing through the member, a member having a recessed cut portion on the surface, and a member having a cut portion piercing through the member and a recessed cut portion on the surface), a member (K') and one or more active energy ray curable resin layers (X') having a cut portion at a portion of the layer, the cut portion having a minimum width within a range from 1 to 1000 µm, are laminated and two or more cut portions in the members are connected to form a cavity.
L'invention concerne un procédé de fabrication d'un microdispositif ayant de fines cavités capillaires se présentant sous la forme de parties découpées dans une couche fragile très mince et, en particulier, un procédé de fabrication à haut rendement d'un microdispositif à système tridimensionnel de canaux complexes. L'invention concerne en outre un microdispositif multifonction à canaux capillaires fins à intersections tridimensionnelles, dans lequel une pluralité de couches de résine sont appliquées tout en étant interconnectées par de fines cavités capillaires qui traversent les couches, cependant qu'il est prévu un espace jouant le rôle de réservoir réactionnel, une vanne à membrane et une structure de vanne. Le procédé de fabrication consiste à former un revêtement semi-durci d'une composition durcissant par faisceau d'énergie active, ayant des parties découpées sur un support de revêtement, à appliquer le revêtement semi-durci sur d'autres éléments et à retirer le support, à durcir le revêtement en l'irradiant de nouveau par un faisceau d'énergie active, avant, ou après, ou en même temps qu'on enlève le support, puis à lier ledit revêtement à l'autre élément.
Anazawa Takanori
Teramae Atsushi
Kawamura Institute Of Chemical Research
Kirby Eades Gale Baker
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