B - Operations – Transporting – 81 – B
Patent
B - Operations, Transporting
81
B
B81B 5/00 (2006.01) B81B 3/00 (2006.01) B81B 7/00 (2006.01) F03G 7/06 (2006.01) H01H 1/00 (2006.01) H01H 61/02 (2006.01)
Patent
CA 2334794
Improved microelectromechanical structures include spaced-apart supports on a microelectronic substrate and a beam that extends between the spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced-apart supports. A heater, located on the beam, applies heat to the beam and displaces with the beam as the beam displaces. Therefore, heat can be directly applied to the arched beam, thereby reducing thermal loss between the heater and the arched beam. Furthermore, an air gap between the heater and arched beam may not need to be heated, thereby allowing improved transient thermal response. Moreover, displacing the heater as the arched beam displaces may further reduce thermal loss and transient thermal response by reducing the separation between the heater and the arched beam as the arched beam displaces.
Cowen Allen Bruce
Hill Edward Arthur
Mahadevan Ramaswamy
Wood Robert L.
Cronos Integrated Microsystems
Memscap S.a.
Sim & Mcburney
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