Microstructure comprising a surface which is functionalised...

B - Operations – Transporting – 81 – B

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B81B 3/00 (2006.01) A61B 5/00 (2006.01) G01L 9/00 (2006.01)

Patent

CA 2496320

The invention relates to an electromechanical microstructure (1) consisting of a first mechanical part (102) which is made from a first conductive material and which comprises (i) an elastically-deformable area (104) having a given thickness value and an exposed surface (2) and (ii) a first organic film (4) having a given thickness, which is disposed over the entire exposed surface (2) of the aforementioned deformable area (104). The invention is characterised in that (a) the thickness of the first film (4) is such that the elastic response of the deformable area (104) comprising the first film (4) does not change by more than 5 % in relation to the response of the bare deformable area (104) or (b) in that the thickness of the first film (4) is ten times smaller than the thickness of the deformable area (104). The invention is suitable for the production of electromechanical microstructures.

Microstructure électromécanique (1) comprenant une première partie appelée partie mécanique (102) réalisée dans un premier matériau conducteur de l'électricité, et qui comprend d'une part une zone déformable de manière élastique (104) ayant une valeur d'épaisseur et une surface exposée (2), et d'autre part un premier film organique (4) ayant une épaisseur, présent sur l'ensemble de la surface exposée (2) de la dite zone déformable (104), caractérisé en ce que l'épaisseur du premier film (4) est telle que la réponse élastique de la zone déformable (104) munie du premier film (4) ne change pas de plus de 5 % par rapport à la réponse de la zone déformable nue (104) ou en ce que l'épaisseur du premier film (4) est inférieure à dix fois l'épaisseur de la zone déformable (104). Application à la fabrication de microstructures électromécaniques.

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