Process for manufacturing micromechanical devices containing...

B - Operations – Transporting – 81 – C

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B81C 99/00 (2010.01)

Patent

CA 2623020

A process for manufacturing micromechanical devices is described, said devices being formed by joining two parts together by direct bonding, one of the parts (12) being made of silicon and the other one being made of a material chosen between silicon and a semiconductor ceramic or oxidic material, such that the joint between the two parts forms a cavity (14) containing the functional elements of the device (11), possible auxiliary elements and a getter material deposit (13).

La présente invention concerne un procédé de fabrication de dispositifs micromécaniques, lesdits dispositifs étant formés en joignant deux parties l~une à l~autre par liaison directe, une des parties (12) étant faite de silicium et l~autre étant faite d~un matériau choisi entre le silicium et un matériau semi-conducteur céramique ou oxyde, de sorte que le joint entre les deux parties forme une cavité (14) qui contient les éléments fonctionnels du dispositif (11), des éléments auxiliaires possibles et un dépôt de matériau getter (13).

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