Production of microfluidic devices using laser-induced...

B - Operations – Transporting – 81 – B

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B81B 1/00 (2006.01) B23K 26/36 (2006.01) B81C 1/00 (2006.01)

Patent

CA 2654453

A method an apparatus for manufacturing a microfluidic device (10) is disclosed in which a laser is used to remove selected portions of one of the layers that make up the device. The portion of the layer may be removed before the layer is amalgamated with other layers making up the device, or the portion may be removed after the layers have been bonded together. The laser beam used to accomplish removal is a combination of at least two laser beams (3, 4), one of which (3) may be a continuous beam to form a melt of the portion to be removed, the other (4) being pulsed or modulated in some way to periodically induce shockwaves which remove the portion. The laser beams use at least one part (5, 8, 9) of the same alignment system.

L'invention concerne un procédé et un appareil pour fabriquer un dispositif microfluidique (10) qui utilisent un laser pour enlever des parties choisies d'une des couches qui forment le dispositif. La partie de la couche peut être enlevée avant que la couche ne soit amalgamée avec les autres couches formant le dispositif, ou bien la partie peut être enlevée après que les couches aient été liées entre elles. Le faisceau laser utilisé pour effectuer cette ablation est une combinaison d'au moins deux faisceaux laser (3, 4), dont l'un des deux (3) peut être un faisceau continu pour faire fondre la partie à enlever, l'autre (4) étant pulsé ou modulé d'une certaine façon pour induire périodiquement des ondes de choc qui enlèvent la partie. Les faisceaux laser utilisent au moins une partie (5, 8, 9) du même système d'alignement.

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