Resist, barc and gap fill material stripping chemical and...

Details Resist, barc and gap fill material stripping chemical and... Resist, barc and gap fill material stripping chemical and...

G - Physics

03

F

G03F 7/42 (2006.01) C09K 13/08 (2006.01) C23F 1/14 (2006.01) C23G 1/00 (2006.01) H01L 21/311 (2006.01)

Patent

CA 2590325

An aqueous-based composition and process for removing photoresist, bottom anti- reflective coating (BARC) material, and/or gap fill material from a substrate having such material(s) thereon. The aqueous-based composition includes a fluoride source, at least one organic amine, at least one organic solvent, water, and optionally chelating agent and/or surfactant. The composition achieves high-efficiency removal of such material(s) in the manufacture of integrated circuitry without adverse effect on metal species on the substrate, such as copper, and without damage to SiOC-based dielectric materials employed in the semiconductor architecture.

Composition à base aqueuse et procédé servant à retirer de la résine photosensible, un matériau de revêtement anti-réfléchissant de fond (BARC) et/ou un matériau de remplissage d'espace d'un substrat revêtu par l'un ou l'autre de ces matériaux cette composition à base aqueuse comprend une source de fluorure, au moins une amine organique, au moins un solvant organique, de l'eau et éventuellement un agent séquestrant et/ou un tensioactif. Cette composition permet un décapage extrêmement efficace dans la fabrication de circuits intégrés, sans exercer d'effet contraire sur les métaux du substrat, tels que du cuivre, et sans détériorer les matériaux diélectriques à base de SiOC utilisés dans l'architecture des semi-conducteurs.

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