Sealed wafer packaging of microelectromechanical systems

Details Sealed wafer packaging of microelectromechanical systems Sealed wafer packaging of microelectromechanical systems

B - Operations, Transporting

81

B

B81B 7/02 (2006.01) B81C 99/00 (2010.01)

Patent

CA 2640827

Multiple microelectromechanical systems (MEMS) on a substrate (20) are capped with a cover (28) using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate (20) has a first side (20A) with multiple MEMS devices. A cover (28) is formed with through-holes (40) for vias (40), and with standoff posts (34) for layer registration and separation. An adhesive sheet (42) is patterned with cutouts (44) for the MEMS devices, vias (40), and standoff posts (34). The adhesive sheet (42) is tacked to the cover (28), then placed on the mems substrate (20) and heated to bond the layers. The via holes (40) may be metalized with leads for circuit board (58) connection. The mems units (22) may be diced from the substrate (20) after sealing, thus protecting them from contaminants.

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