B - Operations – Transporting – 81 – B
Patent
B - Operations, Transporting
81
B
B81B 3/00 (2006.01) F16K 7/00 (2006.01) F16K 11/00 (2006.01) F16K 31/02 (2006.01) F16K 31/64 (2006.01) H01H 61/00 (2006.01) H01H 61/01 (2006.01) H01L 21/00 (2006.01) H01L 49/00 (2006.01)
Patent
CA 2299131
A flexible area 2 is joined at one end via a thermal insulation area 7 to a semiconductor substrate 3 which becomes a frame and at an opposite end to a moving element 5. The thermal insulation area 7 is made of a thermal insulation material a resin such as polyimide or a fluoridated resin. The flexible area 2 is made up of a thin portion 2S and a thin film 2M different in thermal expansion coefficient. when a diffused resistor 6 formed on the surface of the thin portion 2S is heated, the flexible area 2 is displaced because of the thermal expansion difference between the thin portion 2S and the thin film 2M, and the moving element 5 is displayed with respect to the semiconductor substrate 3.
Kamakura Masanao
Kawada Hiroshi
Nagao Shuichi
Nobutoki Kazuhiro
Ogihara Jun
Matsushita Electric Works Ltd.
Riches Mckenzie & Herbert Llp
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