Silicon carbide power mosfets having a shorting channel and...

H - Electricity – 01 – L

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H01L 29/78 (2006.01) H01L 21/336 (2006.01) H01L 29/10 (2006.01) H01L 29/24 (2006.01)

Patent

CA 2457919

Silicon carbide metal-oxide semiconductor field effect transistors (MOSFETs) and methods of fabricating silicon carbide MOSFETs are provided. The silicon carbide MOSFETs have an n-type silicon carbide drift layer, spaced apart p- type silicon carbide regions in the n-type silicon carbide drift layer and having n-type silicon carbide regions therein, and a nitrided oxide layer. The MOSFETs also have n-type shorting channels extending from respective ones of the n-type silicon carbide regions through the p-type silicon carbide regions to the n-type silicon carbide drift layer. In further embodiments, silicon carbide MOSFETs and methods of fabricating silicon carbide MOSFETs are provided that include a region that is configured to self-deplete the source region, between the n-type silicon carbide regions and the drift layer, adjacent the oxide layer, upon application of a zero gate bias.

L'invention concerne des transistors de puissance à effet de champ à semi-conducteur à oxyde métallique (MOSFET) en carbure de silicium et leurs procédés de fabrication. Ces transistors MOSFET en carbure de silicium comprennent une couche de carbure de silicium de type N à effet de champ, des zones de carbure de silicium de type P espacées dans ladite couche de carbure de silicium de type N à effet de champ et des zones de carbure de silicium de type N dans cette dernière, et une couche d'oxyde nitrurée. Ces transistors MOSFET comprennent également des canaux court-circuit de type N qui s'étendent depuis des zones respectives de carbure de silicium de type N jusqu'à la couche de carbure de silicium de type N à effet de champ en passant par les zones de carbure de silicium de type P. D'autres modes de réalisation de l'invention concernent des transistors MOSFET en carbure de silicium et leurs procédés de fabrication, ces transistors comprenant une zone conçue pour auto-appauvrir la zone source, entre le zones de carbure de silicium de type N et la couche à effet de champ, adjacente à la couche d'oxyde, sur application de polarisation de grille nulle

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