Stripping and cleaning compositions for microelectronics

G - Physics – 03 – F

Patent

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G03F 7/42 (2006.01) C23F 11/00 (2006.01) H01L 21/00 (2006.01)

Patent

CA 2536159

Aqueous cleaning compositions and method of using the cleaning compositions for cleaning microelectronic substrates, which compositions are able to essentially completely clean such substrates and produce essentially no metal corrosion of the metal elements of such substrates. The aqueous cleaning compositions of this invention have (a) water, (b) at least one of ammonium and quaternary ammonium ions and (c) at least one of hypophosphite (H¿2?PO¿2??-¿) and/or phosphite (HPO¿3??2-¿) ions. The cleaning compositions also may contain fluoride ions. Optionally, the composition may contain other components such as organic solvents, oxidizing agent, surfactants, corrosion inhibitors and metal complexing agents.

La présente invention a trait à des compositions de nettoyage aqueuses et un procédé d'utilisation des compositions de nettoyage pour le nettoyage de substrats micro-électroniques, lesdites compositions étant aptes au nettoyage sensiblement complète de tels substrats en ne produisant sensiblement aucune corrosion du métal des éléments métalliques de tels substrats. Les compositions de nettoyage aqueuses de la présente invention comportent (a) de l'eau, (b) au moins un parmi des ions d'ammonium et d'ammonium quaternaire et (c) au moins un parmi des ions d'hypophosphite (H¿2?PO¿2??-¿) et/ou de phosphite (HPO¿3??2-¿). Les compositions de nettoyage peuvent également contenir des ions de fluorure. La composition peut éventuellement contenir d'autres constituants tels que des solvants organiques, des agents d'oxydation, des tensioactifs, des inhibiteurs de corrosion et des métaux complexants.?¿

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