Structures and materials for dye sensitized solar cells

Details Structures and materials for dye sensitized solar cells Structures and materials for dye sensitized solar cells

H - Electricity

01

G

H01G 9/20 (2006.01) H01L 25/04 (2006.01) H01L 31/00 (2006.01) H01L 31/0264 (2006.01) H01L 31/04 (2006.01) H01L 31/05 (2006.01) H01M 14/00 (2006.01)

Patent

CA 2474491

Materials of, structures of, and methods of forming photovoltaic cells and modules are described. In particular, the invention, in one embodiment, provides wires to interconnect conductive layers of a cell or module. The photoactive layer may be sintered on a metal foil at either high or low temperatures to form a flexible photovoltaic cell or module. In addition, photovoltaic cells or modules may be formed on rigid substrates to enhance the longevity and durability of the cell or module. Discrete photovoltaic cells or modules may be formed by parting an electrically conductive coating on a polymeric substrate and melting a least a portion of the polymeric substrate, thus encapsulating any debris formed when the conductive layer is parted. In addition, a method of using an ultrasonic slitting device to cut and seal the edges of photovoltaic cells and modules is described.

L'invention porte sur des substances, des structures et des procédés de formations de photopiles et de modules. L'invention porte, selon une forme d'exécution, sur des câbles destinés à interconnecter des couches conductrices d'une pile ou module. La couche photoactive peut être frittée sur une feuille métallique à basse ou haute température afin de former une photopile ou module flexible. Les photopiles ou modules peuvent être formés sur des substrats rigides afin de renforcer la durée de vie et la durabilité de la pile ou module. Pour former des photopiles ou modules distincts, on sépare une revêtement électroconducteur sur un substrat polymère et on mélange au moins une partie du substrat polymère, ce qui permet d'encapsuler tous les débris formés lorsque la couche conductrice est séparée. L'invention porte, de plus, sur un procédé d'utilisation d'un dispositif de coupe ultrasonique permettant de couper et sceller les bords des photopiles et des modules.

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