System and method for protecting microelectromechanical...

B - Operations – Transporting – 81 – B

Patent

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B81B 7/04 (2006.01) B81B 7/02 (2006.01) G02B 26/00 (2006.01)

Patent

CA 2516638

Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate 101, an interferometric modulation display array 111 formed on the substrate 101, and a back-plate 130. The back-plate is placed over the display array 111 with a gap 124 between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back- plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.

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