System and method for protecting microelectromechanical...

Details System and method for protecting microelectromechanical... System and method for protecting microelectromechanical...

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81

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B81B 7/04 (2006.01) B81B 7/02 (2006.01) B81C 1/00 (2006.01) G02B 26/00 (2006.01) G02F 1/01 (2006.01) G02F 1/13 (2006.01) G02F 1/21 (2006.01)

Patent

CA 2518901

Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate 101, an interferometric modulation display array 111 formed on the substrate 101, and a back-plate 130. The back-plate is placed over the display array 111 with a gap 124 between the back-plate and the display array. The depth of the gap may vary across the back-plate. The back-plate can be curved or have a recess on its interior surface facing the display array. Thickness of the back-plate may vary. The device may include reinforcing structures which are integrated with the back-plate.

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