Vacuum sealed microdevice packaging with getters

Details Vacuum sealed microdevice packaging with getters Vacuum sealed microdevice packaging with getters

B - Operations, Transporting

81

B

B81B 7/00 (2006.01)

Patent

CA 2557740

One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes one or more bond pads to receive one or more getters. The center wafer includes one or more vias substantially aligned and corresponding to the one or more bond pads. One or more getters are inserted into the one or more vias. The stacked wafer assembly is completed by aligning a top cover wafer opposite the bottom cover wafer to sandwich the center wafer in between. A constant vacuum level is maintained inside the microdevice packages by aligning the wafers, activating the getters, and sealing the microdevice packages in a given sequence.

L'invention porte dans une exécution sur un emballage sous vide de micro-dispositifs, incluant des dégazeurs pour y maintenir un niveau constant de vide. A cet effet on forme un empilement de tranches contenant plusieurs boîtiers de micro dispositifs en alignant sur une tranche centrale la tranche inférieure de couverture qui comporte un ou plusieurs plots de fixation destinés à recevoir un ou des dégazeurs. La tranche centrale comporte un ou des trous d'interconnexion sensiblement alignés sur le ou les plots de liaison. On introduit alors un ou plusieurs dégazeurs dans le ou les trous d'interconnexion. On achève l'empilement de tranches en alignant la tranche supérieure de couverture opposée à la tranche inférieure de couverture entre lesquelles se trouve la tranche centrale. Le niveau constant de vide à l'intérieur dans les boîtiers des micro-dispositifs en alignant les tranches, en activant les dégazeurs, et en scellant les boîtiers des micro-dispositifs dans un ordre donné.

Affiliated with

Also associated with

Rating

Vacuum sealed microdevice packaging with getters does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Vacuum sealed microdevice packaging with getters, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Vacuum sealed microdevice packaging with getters will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1876143