4. H - Electricity
  5. 01
  6. L

Scott L. Jacobs

H - Electricity – 01 – L

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Country: United States Of America

High performance integrated circuit chip package and method...

H - Electricity – 01 – L
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Module for packaging semiconductor integrated circuit chips...

H - Electricity – 01 – L
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Plasma-resistant polymeric material, preparation thereof,...

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Profile ID: LFCA-PAI-P-1162964

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