Device for treating planar elements with a plasma jet

H - Electricity – 01 – L

Patent

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Details

H01L 21/02 (2006.01) H01L 21/302 (2006.01) H01L 21/677 (2006.01) H01L 21/683 (2006.01)

Patent

CA 2210130

Used in the technical field of plasma treatment of planar elements such as plates, sheets and wafers in electronics and electrical engineering, the invention in essence is a device for treating wafers with a plasma jet. The device comprises the following elements mounted in a closed chamber (1): a drive (12) which effects angular displacement of the holders (14) which are provided with a common rotary drive (18); a plasma jet generator (10); and, mounted outside the closed chamber (1), a manipulator (27) and storage devices (28) for the wafers (29). The wafer (29) to be treated is picked up by the manipulator (27) from the storage device (28) and placed in the holder (14) which together with the wafer (29) passes over the plasma jet generator (10) used for the treatment. The cycle may be repeated a predetermined number of times.

Le dispositif selon l'invention s'applique au domaine du traitement au plasma d'éléments plans tels que des plaques, des feuilles et des tranches dans l'ingénierie électrique et électronique. Ce dispositif, qui est conçu pour traiter les éléments plans à l'aide d'un jet de plasma, est constitué des éléments suivants qui sont montés dans une chambre fermée (1): un moyen d'entraînement (12) qui provoque le déplacement angulaire des supports (14) qui sont dotés d'un entraînement rotatif commun (18); un générateur de jet de plasma (10); et, monté à l'extérieur de la chambre fermée (1), un manipulateur (27) et des unités de stockage (28) des éléments (29). L'élément nécessitant le traitement (29) est sélectionné dans le dispositif de stockage par le manipulateur (27) et placé dans le support (14) qui, conjointement avec l'élément (29), passe au-dessus du générateur de jet de plasma (10) utilisé pour le traitement. Le cycle peut être répété autant de fois que nécessaire.

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