Method and apparatus for reducing surface defects in...

B - Operations – Transporting – 81 – C

Patent

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B81C 1/00 (2006.01)

Patent

CA 2599081

A removal assembly and method for removing a submaster from a master is described. A curved tooling surface is arranged within a housing of the assembly. A first array of vacuum cups is attached to the housing adjacent a first end of the curved tooling surface, where the first array of vacuum cups are configured to provide a vacuum grip on a first portion of the submaster. A second array of vacuum cups is attached to the housing adjacent a second end of the curved tooling surface, where the second end opposes the first end, the second array of vacuum cups is configured to provide a vacuum grip on a second portion of the submaster. A rotation mechanism is configured to rotationally support the master as the master is rolled along the curved tooling surface to remove the submaster.

L'invention concerne un ensemble de retrait et un procédé permettant de retirer un sous-gabarit d'un gabarit. Une surface d'usinage incurvée est située dans une enveloppe de cet ensemble. Un premier arrangement de coupelles sous vide est fixé à l'enveloppe à côté d'une première extrémité de la surface d'usinage incurvée, ce premier arrangement de coupelles sous vide étant conçu pour une prise sous vide d'une première partie du sous-gabarit. Un second arrangement de coupelles sous vide est fixé à l'enveloppe à côté d'une seconde extrémité de la surface d'usinage incurvée, cette seconde extrémité étant opposée à la première extrémité, et le second arrangement de coupelles sous vide étant conçu pour une prise sous vide d'une seconde partie du sous-gabarit. Un mécanisme de rotation est conçu pour supporter de façon rotative le gabarit alors que celui-ci est pivoté le long de la surface d'usinage incurvée pour retirer le sous-gabarit.

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