Method and device for packaging a substrate

Details Method and device for packaging a substrate Method and device for packaging a substrate

B - Operations, Transporting

81

B

B81B 7/02 (2006.01) B81C 1/00 (2006.01) G02B 26/00 (2006.01) G02F 1/01 (2006.01) G02F 1/13 (2006.01) G09F 9/30 (2006.01)

Patent

CA 2514348

A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.

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