B - Operations – Transporting – 81 – B
Patent
B - Operations, Transporting
81
B
B81B 3/00 (2006.01) B81C 1/00 (2006.01) G02B 26/08 (2006.01)
Patent
CA 2536431
A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower substrate. The upper substrate is selectively etched in its top layer to form therein a plurality of posts which project commonly from a bottom layer of the upper substrate. The posts include the fixed components to be fixed to the lower substrate and the movable components which are resiliently supported only to one or more of the fixed components to be movable relative to the fixed components. The lower substrate is formed in its top surface with at least one recess. The upper substrate is then bonded to the top of the lower substrate upside down in such a manner as to place the fixed components directly on the lower substrate and to place the movable components upwardly of the recess. Finally, the bottom layer of the upper substrate is removed to release the movable components from the bottom layer for floating the movable components above the recess and allowing them to move relative to the lower substrate, while keeping the fixed components fixed to the top of the lower substrate.
L'invention concerne un procédé pour fabriquer un système micro-électro-mécanique (MEMS) comprenant des composants fixes, supportés de manière fixe sur un substrat inférieur et des composants mobiles supportés de manière mobile sur le substrat inférieur. Le procédé utilise le substrat supérieur séparément, ce dernier étant gravé de manière sélective sur sa couche supérieure, ce qui permet de former une pluralité de tiges qui font saillie à partir d'une couche de base du substrat supérieur. Les tiges comprennent des composants fixes à fixer au substrat inférieur et les composants mobiles sont fixés, de manière à pouvoir être détachés, sur un ou plusieurs composants fixes, ce qui les rend mobiles par rapport aux composants fixes. La surface supérieur du substrat inférieur est pourvu d'au moins un renfoncement. Le substrat supérieur est ensuite lié à la partie supérieure du substrat inférieur de haut en bas, de manière à placer les composants fixes directement sur les substrats inférieurs et à placer les composants mobiles au-dessus du renfoncement. Finalement, la couche de base du substrat supérieur est éliminée, de manière à libérer les composants mobiles de la couche de base, ce qui permet de faire flotter lesdits composants au-dessus du renfoncement et de les déplacer par rapport au substrat inférieur, tout en maintenant les composants fixes sur la partie supérieure du substrat inférieur.
Fukshima Hiroshi
Harada Hiroshi
Kawano Kiyohiko
Noge Hiroshi
Ogihara Jun
Marks & Clerk
Matsushita Electric Works Ltd.
Panasonic Electric Works Co. Ltd.
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