4. H - Electricity
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Paul M. Enquist

H - Electricity – 01 – L

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Country: United States Of America

3d ic method and device

H - Electricity – 01 – L
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Method for low temperature bonding and bonded structure

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Room temperature metal direct bonding

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Single mask via method and device

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Three dimensional device integration method and integrated...

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Profile ID: LFCA-PAI-P-1492644

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