LandOfFree - Canadian Patents - Listing for C

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Copper cyanide electrolytes and electrodeposition of copper...

C - Chemistry – Metallurgy – 25 – D

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Copper cyanide electroplating process and apparatus

C - Chemistry – Metallurgy – 25 – D

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Copper cyanide plating process and solution therefor

C - Chemistry – Metallurgy – 25 – D

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Copper cyanide plating process and solution therefor

C - Chemistry – Metallurgy – 25 – D

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Copper electrodeposition electrolytes

C - Chemistry – Metallurgy – 25 – D

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Copper electrodeposition with substituted phthalocyanine and...

C - Chemistry – Metallurgy – 25 – D

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Copper electroplating

C - Chemistry – Metallurgy – 25 – D

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Copper electroplating bath including compound with...

C - Chemistry – Metallurgy – 25 – D

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Copper electroplating process

C - Chemistry – Metallurgy – 25 – D

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Copper foil for the manufacture of printed circuits and...

C - Chemistry – Metallurgy – 25 – D

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Copper metallization of silicon wafers using insoluble anodes

C - Chemistry – Metallurgy – 25 – D

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Copper or copper alloy surface preparation process for...

C - Chemistry – Metallurgy – 25 – D

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Copper plating bath containing chloride, polysulfide,...

C - Chemistry – Metallurgy – 25 – D

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Copper plating process

C - Chemistry – Metallurgy – 25 – D

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Copper plating process

C - Chemistry – Metallurgy – 25 – D

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Copper plating process

C - Chemistry – Metallurgy – 25 – D

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Copper plating with addition agents

C - Chemistry – Metallurgy – 25 – D

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Copper substrate overlaid with a nickel oxide barrier layer...

C - Chemistry – Metallurgy – 25 – D

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Copper wire and process for making copper wire

C - Chemistry – Metallurgy – 25 – D

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Copper-chromium-polyimide composite

C - Chemistry – Metallurgy – 25 – D

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